Back ceramic panels, networks, hybrides

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96% Al2O3 thick-film alumina-substrates scribed, drilled, cutted

99% Al2O3 thin-film alumina-substrates laser cutted and -drilled

AlN aluminum nitride-substrates scribed, drilled, cutted

already sintered LTCC-substrates laser scribed

panel and network substrates, ceramic circuit carriers for thick and thin film hybrids, hybrid integrated circuits, circuits boards

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