LCP Laser Cut Processing

Latest news from the company

Silicon wafers processed with innovative USP laser technology and cut into individual chips

Innovative ultrashort pulse laser technology revolutionizes the processing of silicon wafers

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IHK student’s college

Your summer internship - experience the fascination of modern laser technology!

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PCIM Europe 2024

LCP presents smart solutions at PCIM Europe 2024!

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Sensor+Test 2024

LCP highlights at the SENSOR+TEST 2024

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Colorful Girls'Day lettering on white background

LCP is involved and supports Girls'Day 2024

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Fundraising campaign for LCP's 30th anniversary

Review of the LCP anniversary donation campaign

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Coiltech Deutschland 2024

LCP at Coiltech Deutschland 2024

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LCP's sporting commitment to handball

LCP's sporting commitment to women's handball

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laser machined TO package

Laser precision meets miniaturization: The future of TO packages for NDIR gas analysis

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30 years of LCP company anniversary

30 years LCP - a company with an impressive development

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