Back Process innovation: machining of glass

Laser structuring of special materials for technical analysis

For more than 20 years the LCP Laser-Cut-Processing GmbH performs laser precision machining of medical stainless and spring steel, titanium, nickel-titanium alloys, tungsten, tantalum, molybdenum as well as technical ceramics and glass. Especially by metrologically analyzing liquid and solid samples under demanding parameters special carrier substrates are applied increasingly. Those materials enable free-degassing use in vacuum, are resistant towards acids and bases, have no water absorption capacity and additionally are well suited for many radiation analysis techniques or for high pressure and temperature requirements. The increasing demand of such applications gave us the motivation to develop special process technologies. Currently we are able to cut, drill and ablate finest layouts in carrier substrates out of silicon, diverse ceramics (e.g. Al2O3, SiN) and glass (e.g. D263Teco, AF32, fused silica, sapphire). Furthermore all substrates or panels could be individually and automated labeled or marked for continuous traceability. 

 

 Please contact: Ms. Antje Oßmann, fon.: +49 36601 9327-54, e-mail: sales@lcpgmbh.de

 

 

 

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