Back Substrat materials for micro electronic and high power applications

Al2O3, AlN, SiN, SiC, 3YSZ, silicon, fused silica, D263T, Borofloat33 or

copper, aluminum, titanium, stainless steel, polyimide

Herewith we would like to show you a small range of available and for us machinable substrat materials which could be used as circuit board devices. The spectrum starts with ceramic tapes (Al2O3, AlN, SiN, SiC, 3YSZ) for high power applications with very good electrical insulation and high thermal persistence and goes on with diverse glass substrates or pure semiconductive silicon materials and ends with cost-effective organic materials. In the same way we offer raw materials with high thermal conductivity like copper, aluminum, titanium, stainless steel foils or we manufacture out of it contact elements and springs, heat sinks or heat spreader for composition and packaging of your electronic circiut board. The increase of ampacity, the optimization of thermal conductivity, the increase in thermal shock resistance and the improvement of system reliability with simultaneous reduction of system costs are the current main requirements for application-specific substrat materials.

 

 

We intensively support electronic manufacturer (EMS) at manifold positions. Please ask us for material supply, data sheets or find the best solution to produce your specific substrat layouts for example with our laser scribing, laser drilling, laser structuring or wafer dicing technologies. Additionally we fabricate individual tools and gadgets for your own production processes (e.g.support masks, press pads, vacuum suction arrays, sputtering masks, several stencils) or we offer our experiences in laser fine welding and selective laser soldering or product direct marking to enhance your manufacturing penetration.

 

Please contact: Mr. Tim Friedel, fon.: +49 36601 9327-52, e-mail: sales@lcpgmbh.de

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