LCP Laser Cut Processing

Power Electronics

Forming, controlling, switching

Finest components for power electronics

In the product spectrum of power electronics, we manufacture individual components for power electronic assemblies such as motor drives, power supplies, power boards and frequency converters, so-called electronic stacks.

In general, power electronics deals with the conversion, control and switching of electrical energy in various electronic components and thus covers an important subarea of electrical engineering. In hybrid and electric vehicles, it forms a central component of drive technology. This includes, among other things, the control of an electric machine or the communication with the vehicle control system. In the field of renewable energies, special magnetic materials are also required, such as those used for generators in wind power plants.

Current-carrying contact elements

When it comes to the production of sophisticated mechanical components and metallic conductors and connectors such as busbars, contact elements and EMC housings, we are the right partner.

Ceramic Substrates

In addition to controlling electrical energy, power electronics must also solve important thermal management tasks: For example, a heat sink made of suitably thermally conductive material has the task of conducting heat loss away from the heat-generating component and dissipating it to the environment in order to increase its service life.

In this context, special ceramics are excellently suited to the production of current-carrying printed circuit boards or circuit carriers due to their good electrical insulator properties combined with high thermal conductivity and resistance, and thus represent an important component for the steadily growing market of power electronics.

Substrate materials in micro- and power electronics

Our selection of machinable substrate materials for use as circuit carriers:

  • ceramic substrates such as aluminum nitride or silicon nitride for power electronics with high electrical insulation and high thermal resistance
  • glass substrates and pure semiconductor material silicon
  • low-cost organic substrate materials
  • materials with very high thermal conductivity such as stainless steel, aluminum, titanium or copper

Requirements for application-specific substrate materials:

  • increase of current carrying capacity
  • optimization of thermal conductivity
  • increase of thermal shock resistance
  • improvement of system reliability with simultaneous reduction of costs

Download data sheets

  • pdf
    Ceramics Machining
    263 KB
  • pdf
    Design Guideline Ceramics
    480 KB
  • pdf
    Ultra Short Pulse Ferrite Machining
    510 KB
  • pdf
    Laser Fine Cutting
    321 KB
  • pdf
    Precision Bending
    213 KB
  • pdf
    Data Transfer
    134 KB

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