Back ceramic, glass, silicon

please note to this list:    
    - l
atest selection without claim to completeness
    - exclusively producer of substrates are list
    - alphabetical order without ranking or priority
    - 
materials data sheet are available on request for every material
    - 
different properties and dimensions are also available
    - 
many materials are in stock or on short call
    - all materials are available lapped or grinded either before or after laser processing

 

Type of materialDescription

Alumina

(Al2O3)

examples:
A476T
AD96R
Keral96
Rubalit 708S
Rubalit HP

 A493

ADS998
Keral99
Keralpor99
PlasmaPure
Rubalit 710

sapphire

mean thermal conductivity (20 - 30 W/mK)
very high electrical insolation (1 x 1014 bis 1 x 1015 Ωcm)
bending strength (800 MPa), high compressive strength (2 - 4 GPa)
thermo shock resistant
good tribological properties
chemical resistant
bioinert and food-compatible
maximum operation temperature between 1000 °C and 1500 °C  (without mechanical stress)
surface as-fired: Ra 0,2-0,8 µm suitable for thick film technology
surface as-fired: Ra < 0,1 µm suitable for thin film technology
available as dense or porous material

 

Producer selection: 
CeramTec, CoorsTek, Kerafol, Kyocera, Maruwa

 

Original formats (selection)
dimensions: 115 x 115/ 165 x 115/ 190 x 138 mm²
thickness: 0,12 - 3,0 mm (+/- 10%)
camber of  0,2 - 0,3% of substrate length (thickness > 0,5 mm)

Aluminum nitride 

(AlN)


examples:
AlUNIT
AIN 170
AIN 180
AIN 200
AIN 230

very high mean thermal conductivity (170 - 230 W/mK)
high electrical insolation (1 x 105 to 1 x 109 Ωcm)
bending strength (300 - 400 Mpa), compressive strength > 2 GPa
thermo shock resistant
chemical resistant: not towards sodium hydroxide solution; inert towards molten III-V-compounds; less suitable for applications at temperatures higher 1000 °C in mediums containing water or oxygen as well as not for applications under mechanical stress with simultaneous wetting of water
manufacturing processes: hot pressing, dry pressing, tape casting

 

Producer selection:  
CeramTec, CoorsTek, FCT, Maruwa

 

Original formats (selection)
dimensions: 114 x 114 / 150 x 140 / 138 x 190 mm²
thickness: 0,25 - 5,0 mm 

Zirconium oxide 

(ZrO2)

examples:
3YSZ
Dura-Z
Keralpor99 Z
Keraprotec
PSZ
Rubalit HSS
YTZP
ZTA

low mean thermal conductivity (1,5 - 3 W/mK)
high electrical insolation, oxygen ion conductive
high bending strength (> 1 GPa) and fracture resistance

very high compressive strength (> 4,7 GPa)
very good tribological properties
chemical resistant
fatigue resistant because of phase transistion hardening
bioinert  and food-compatible
maximum operation temperature between 600 °C and 1100 °C
also available as porous sintering supports with high planarity and purity

 

Producer selection:  
CeramTec, CoorsTek, Kerafol, Maruwa

 

Original formats (selection)
dimensions: 50 x 50 / 100 x 100 / 150 x 150 mm²
thickness: 0,15 - 0,5 mm (+/- 10%)

Silicon carbide 

(SiC)

examples:
SiC
RSiC
SiSiC
Ultra-SiC
UltraClean
Pure-SiC

very high mean thermal conductivity (120 - 200 W/mK)
high hardness
corrosion-resistant
good tribological properties
temperature change resistant
maximum operation temperature between 1350 °C and 1600 °C
manufacturing processes: directly sintered, recrystallized, CVD (highly purified)

 

Producer selection:  
CoorsTek, FCT, H.C.S. Ceramics, Saint Gobain, CeramTec

 

Original formats (selection)
dimensions: 150 x 150 / 115 x 115 mm²
thickness: 2,0 - 6,0 mm 

Silicon nitride 

(Si3N4)


examples:
Kersit 303
Si3N4

midsize mean thermal conductivity
high compressive strength (3 GPa) 
high fracture toughness (7 MPa√m)
good tribological properties
temperature change, thermo shock and high temperature resistant 
chemical resistant

 

Producer selection:  
CoorsTek, FCT, H.C.S. Ceramics, Kyocera

 

Original formats (selection)
dimensions: Ø 650 mm bis 700 x 450 mm²
thickness: 1,0 - 5,0 mm

Glass ceramics /

Glass

examples:
LTCC
Borofloat
Quartz glass
Glass folder foils

LTCC (Low-Temperature-Cofired-Ceramic):
unsintered (compound of glass, ceramics and organic solvents), flexible
sintering temperatures already at 900 °C, good for co-firing with metals
suitable for HF-applications
mean thermal conductivity (typical 2 - 3 W/mK)
maximum operation temperature only a few 100 °C

Glass:
mean thermal conductivity (0,6 - 1,4 W/mK)
electrical insolation (1010 to 1014 Ωm)
maximum operation temperature depends on glass system (100 °C - 1000 °C)
thermo shock resistance depends on glass system

available with filter/ protection coatings (one-sided, double-sided)

 

Producer selection: 
AGC Asahi Glass, CeramTec, Corning, DuPont, Kerafol, Plan Optik, Saint Gobain, Schott AG


Original formats (selection)
dimensions LTCC: up to 152,4 x 152 cm²
thickness LTCC: 127 - 254 µm (unsintered)

dimensions glass: Ø 50,8 / 100 mm to 1150 x 850 mm²
thickness glass: 250 / 430 / 550 / 650 µm

Silicon (Si)


examples:
monocrystalline Si
polycrystalline Si
Si-Wafer monocr.

mean thermal conductivity 150 W/mK
electrical insolation (1 x 10 - 6 to 50 Ωm)
typical operation temperatures between -40 °C and 90 °C
chemical resistance: less reactive, at very high temperatures reactions with different gases possible

available with filter/ protection coatings (one-sided, double-sided)

Producer selection: 
Hemlock Semiconductor Group, Wacker Chemie AG, Siltronic AG, PV Crystalox Solar Silicon GmbH


Original formats (selection)
dimensions: Ø 50,8 / 76,2 / 100 / 150 / 200 / 300 mm
thickness: 0,12 - 3,0 mm

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