Technical Details
The advantages of laser scribing in detail:
- non-contact process, no micro-cracks in the material
- minimal heat-affected zone and high scribing speed
- high flexibility because of individually determinable scribing depth and distance
- optimum area utilisation and material yield due to smallest possible joint widths
- clean, precise cutting with high quality of the individual elements
In which areas is laser scribing used?
A small selection of possible applications for laser scribing:
- for separating wafers in the semiconductor industry
- for separating already printed, sputtered ceramic substrates into individual elements
- for separating panel arrays on thick-film/thin-film substrates
- for structuring IR filter elements
Further services for you
Also discover our other diverse processing technologies. We manufacture precise and individual components according to your specifications - from laser cutting to laser structuring to precision bending.