This term does not only describe the partial and precise surface ablation but also the extensive laser polishing, laser cleaning or laser honing.
Because of diverse processing parameters enormous possibilities for laser processing arise. For example the ablation of thin film layers without harming the carrier substrate, e.g. glass, as well as the local generation of defined surface roughnesses in ceramics and metals or even the cleaning and polishing of easy adherent melting residues on silicon are possible.
You can find more information in our datasheet.