The arrangement of more than one circuit on raw substrates is established when using hard and brittle materials for the production of circuit carriers. To seperate the circuits at the end easily scribe lines (in a row positioned blind holes) as predetermined breaking points were introduced in the material.
The distance and depth of the blind holes can be defined. By overlapping the blind holes it is also possible to generate laser processed notches that are similar to notches punched in unsintered ceramic substrates.
Not only for ceramics but also for glasses, silicon and some metals this processing technology enables a more efficient production of single components by panel arrangements.
You can find more information in our datasheet or design guideline.