Using innovative laser technology and many years of know-how in laser application, the smallest packages and housings for gas sensors can be processed with high precision and in perfect quality.
Fast, extremely precise USP laser processing can be used to produce the smallest ferrite components and other materials for versatile use in power electronics.
Printed circuit boards (PCB) are found in all electronic devices - nothing works without them. In order to ensure long-term stable functionality, clean laser cutting technology is essential for their processing.
Electronic components are small and very sensitive. To ensure a long service life, they must be tightly sealed. The solution is laser fine welding with state-of-the-art laser technology.
LCP manufactures high-precision small precision mechanical components with high accuracy and cleanliness for use in devices for industries such as medical, research and development, electronics, and aerospace.
Glass wafers are very sensitive to breakage and cracking. This makes processing them very demanding. UKP laser technology achieves the best and highest quality results here.
Successful laser fine machining of advanced ceramics, silicon and semiconductor substrates, and glass wafers is achievable through innovative UKP laser technology.
We use cookies on our website. Some of them are technically necessary, while others help us from a marketing perspective to improve this website and your user experience. By clicking on the button "Select all", you consent to all cookies and features. You can give your consent for individual purposes or functions via the option "Show details". By clicking on "Save" you agree to us setting the selected cookies. You have the right to withdraw your consent at any time. For more information, take a look at cookies and data protection.
![[Translate to English:] Silizium Wafer](/fileadmin/_processed_/4/5/csm_silizium_wafer_842_022e209b94.jpg)
