Ceramic Substrates
In addition to controlling electrical energy, power electronics must also solve important thermal management tasks: For example, a heat sink made of suitably thermally conductive material has the task of conducting heat loss away from the heat-generating component and dissipating it to the environment in order to increase its service life.
In this context, special ceramics are excellently suited to the production of current-carrying printed circuit boards or circuit carriers due to their good electrical insulator properties combined with high thermal conductivity and resistance, and thus represent an important component for the steadily growing market of power electronics.
Our selection of machinable substrate materials for use as circuit carriers:
- ceramic substrates such as aluminum nitride or silicon nitride for power electronics with high electrical insulation and high thermal resistance
- glass substrates and pure semiconductor material silicon
- low-cost organic substrate materials
- materials with very high thermal conductivity such as stainless steel, aluminum, titanium or copper





