Ceramic Substrates, Meshes, Hybrids

thin film substrate with notch trenches

properties: t=0,63 mm

material: ceramic 99% Al2O3

technologies: laser cutting,
laser drilling, laser scribing

thick film substrate

properties: t=0.63 mm

material: ceramic 96% Al2O3

special features: Payload substrates, network substrates, ceramic circuit carriers for thick film and thin film hybrids, printed circuit boards.

technologies: laser fine cutting,
laser drilling, laser scribing

AlN-substrate

properties: t=0.5 mm

material: Ceramic AlN

special features: directly after laser processing, before final cleaning

technologies: laser fine cutting,
laser drilling, laser scribing

LTCC substrate (sintered)

properties: 68 x 68 mm

material: ceramic LTCC tape

technologies: laser scribing