Laser surface structuring process graphically illustrated

Create functional surface structures

The purpose of laser structuring is to create simple or complex surface modifications by means of material removal, thermal interaction or precise energy input and thus to functionalize them. It is a process that is used both for roughening or smoothing hardened metallic or ceramic component surfaces for tribological improvements.

The term laser structuring covers both partial and precise surface material removal, as well as large-area laser polishing, laser cleaning and laser honing. There are no limits to the type and scope of laser structuring - regardless of whether you require single or full-surface structuring of components. But it can also be used to activate specific conductive path structures in plastics or to build up layer systems.

In laser structuring with an ultra-short pulse laser, the material vaporizes without leaving any melt residue on the component. Thanks to so-called cold ablation, the material is not melted but vaporized, which enables high-quality structuring of the material. Ultra-short pulse lasers consequently allow cleaner and often post-processing-free microstructuring of surfaces with very high precision.

Technical possibilities of laser processing of surfaces

Laser systems for surface structuring, surface modification and micromachining play a crucial role in industrial manufacturing and research. The various processes such as microstructuring, microcutting, ablation, notching and layer ablation enable precise, flexible and diverse processing in the micrometer range. Both deep ablation and surface modifications are realized by ablation, decoating, polishing or roughening. Cavities and blind holes are also implemented by micromachining. A special technique used in this process are ultrashort pulse laser sources, which generate extremely short pulses in the pico-/femtosecond range. Our services support you in activating and cleaning surfaces through a wide range of processing.

Laser structuring with a broad processing spectrum

Wide range of processing parameters in manufacturing technology:

  • ablate thin film layers without damaging the carrier substrate.
  • produce defined roughness values partially in ceramics and metals.
  • perform cleaning and polishing operations on ablated silicon surfaces to remove easily adhering melt residues. Lateral structure resolution down to five micrometers and depth resolution down to less than one micrometer are possible.

Flexible and fast production of structured tool surfaces:

  • use of various scanner optics for remote machining as well as fixed optics with gas support
  • round axis machining possible with a maximum diameter of up to 90 millimeters and a maximum length of 300 millimeters
  • automatic image recognition and processing of position features and sensor-based measurement of the removed height in the same setup for maximum precision

 

Further details on laser structuring can be found in our data sheets.

Manufacturing technology for different materials

Whether thin-film wafer or thick-film substrate: surface processing by means of laser structuring is suitable for a wide range of different materials. These include metals as well as non-metals and especially hard-brittle materials. Thanks to precise manufacturing technology, the possibilities for processing the following materials are virtually unlimited:

  • aluminum oxide (Al2O3, sapphire)
  • aluminum nitride (AlN)
  • silicon (Si) and silicon nitride (Si3N4)
  • sintered silicon carbide (SSiC)
  • recrystallized silicon carbide (RSiC)
  • glass (-ceramic), quartz
  • plastic printed circuit boards made of FR3/FR4/ FR5 (PCB)
  • ceramic circuit boards or multilayer (LTCC)

Application areas of laser technology

The very high light intensities achieved in micromachining with ultrashort pulse lasers enable the processing of materials where mechanical processing or other laser technologies reach their limits. However, the advantage of laser processing also lies in the flexibility with which any shape can be produced quickly, precisely and economically.

With the help of clamping devices, so-called chucks, or suction devices with negative pressure, the ultrashort pulse laser cuts materials cleanly without damaging them. Ceramics, glasses and metals are drilled, structured and cut without thermal damage to the material. This opens up new possibilities in electronics, mechanics, medical technology and microfluidics. The versatile manufacturing technology is ideal for useful and network substrates and other thick film hybrids. We support you in the fabrication of:

  • heaters,
  • conductors,
  • masks,
  • apertures,
  • stencils,
  • circuit carriers,
  • and microreactors.

Laser processing allows surfaces in the micrometer range to be processed particularly efficiently and precisely. Particularly when using ultrashort pulse lasers, residue-free material removal is feasible, especially when materials are subsequently to be coated - for example, in metallization. For this purpose, no material residues must adhere to the substrates.

Laser structuring – all advantages at a glance

  • precise layer-by-layer material removal or defined property changes
  • filigree microstructuring through smallest spot diameters & optical component referencing
  • no distortion or heat input into the workpiece and therefore burr-free machining
  • demanding materials machinable (hard-brittle; transparent; ultra-thin; multilayer; multiple)
  • laser sources and systems with pulse lengths in the pico- and femto-second range (ultra-short pulse laser)
  • wavelengths of 1,030 nm (IR), 515 nm (green) and 355 nm (UV)
Laser-structured microreactor component for microfluidics, ceramic Al2O3, ablated depth 0.15 mm
microreactor component, ceramic Al2O3, ablated depth 0.15 mm
Laser-structured piezoceramic tube with ablated sputter layer, Ø= 30 mm
piezoceramic tubes with removed sputtering layer, Ø= 30 mm
Laser-structured sample carrier, ceramic Al2O3, laser ablation up to 0.5 mm deep; residual membrane thickness t=0.1 mm
structured specimen support, ceramic Al2O3, laser ablation up to 0.5 mm deep; residual membrane thickness t=0.1 mm
Graphite electrode with laser-structured number matrix
graphite electrode with laser structured number matrix

Download data sheets

  • pdf
    Laser Structuring
    75 KB
  • pdf
    Ultra Short Pulse Machining
    76 KB
  • pdf
    Ultra Short Pulse Machining of Ferrites
    67 KB
  • pdf
    Data Transfer
    85 KB

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Our large portfolio of machining technologies enables us to produce fast, precise and individual components according to your specifications - from laser drilling and wafer dicing to precision manufacturing of drawing parts.

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