On November 6-7, the 14th Jena Laser Conference will once again open its doors to share the latest trends, challenges and development results in the laser industry. LCP will also be there.
On September 12, 2024, we received a special honor at the first award ceremony of the East Thuringia Chamber of Industry and Commerce's award “Companies in responsibility”.
Thanks to innovative ultrashort pulse laser technology, thin-film substrates can be structured with high precision and thus thin and narrow Hall probes can be produced for measuring the smallest air gaps in electric motors.
Have you always wanted to take a look behind the scenes of laser fine machining? Now you have the opportunity. Immerse yourself in the world of #LASERPIONEERS.
Climate change is omnipresent. Making a partial contribution is emission-free locomotion. This is exactly where LCP comes in with its knowledge in laser fine machining of the smallest components.
As an innovative machining process, LCP is developing a so-called waterjet-guided laser process for machining hard-brittle materials, in particular technical ceramics.
When cutting and removing silicon wafers maximum precision is required with the smallest contours on an extended surface. The classic mechanical method of wafer dicing reaches its limits here, as it cannot meet the requirements for fineness…
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