LCP Laser Cut Processing

Housings, Covers, Caps

TO cap

NiFe

TO cap

properties: camera-supported positioning, burr-free, distortion-free

material: NiFe

special features: low-cost deep-drawn component Application-specific individualised transistor caps

technologies: laser structuring

Housing for pressure sensor

Stainless steel

Housing for pressure sensor

properties: sensorhousing

material: stainless steel

special features: high pressure resistant, helium-tight

technologies: laser fine welding

Pipe shielding with solder lugs

Spring steel

Pipe shielding with solder lugs

properties: tube processing; flat spring production

material: spring steel

special features: right-angled attachment of the brazing lugs to the pipe stub; mechanically strong weld seam

technologies: laser fine cutting,
laser fine welding

Cover

Copper

Cover

properties: t=0.2 mm

material: copper

special features: EMC shielding, EMI/RFI shielding

technologies: laser cutting,
precision bending

Cover

Copper

Cover

properties: t=0.2 mm

material: Copper

special features: EMC shielding, EMI/RFI shielding

technologies: laser cutting,
precision bending, laser soldering

  • TO cap

    NiFe

    TO cap

    properties: camera-supported positioning, burr-free, distortion-free

    material: NiFe

    special features: low-cost deep-drawn component Application-specific individualised transistor caps

    technologies: laser structuring

  • Housing for pressure sensor

    Stainless steel

    Housing for pressure sensor

    properties: sensorhousing

    material: stainless steel

    special features: high pressure resistant, helium-tight

    technologies: laser fine welding

  • Pipe shielding with solder lugs

    Spring steel

    Pipe shielding with solder lugs

    properties: tube processing; flat spring production

    material: spring steel

    special features: right-angled attachment of the brazing lugs to the pipe stub; mechanically strong weld seam

    technologies: laser fine cutting,
    laser fine welding

  • Cover

    Copper

    Cover

    properties: t=0.2 mm

    material: copper

    special features: EMC shielding, EMI/RFI shielding

    technologies: laser cutting,
    precision bending

  • Cover

    Copper

    Cover

    properties: t=0.2 mm

    material: Copper

    special features: EMC shielding, EMI/RFI shielding

    technologies: laser cutting,
    precision bending, laser soldering

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    Contact

    If you have questions about specific technologies, materials or applications, please contact the contact person directly using the short form in the relevant section.


    General questions can be directed to us here:

    E-mail:   info(at)lcpgmbh.de

    Phone:   +49 (0) 36601 9327-0

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