Printed circuit boards (PCB) are found in all electronic devices - nothing works without them. In order to ensure long-term stable functionality, clean laser cutting technology is essential for their processing.
We are exhibiting! Take the chance and visit us from November 16-17, 2022 at the Precision Fair to learn all about the latest topics around high precision laser micromachining of components made of various materials!
Electronic components are small and very sensitive. To ensure a long service life, they must be tightly sealed. The solution is laser fine welding with state-of-the-art laser technology.
From November 3-4, experts from industry, research, education and politics will come together to discuss current trends and challenges in the laser industry. Among them will be LCP.
LCP manufactures high-precision small precision mechanical components with high accuracy and cleanliness for use in devices for industries such as medical, research and development, electronics, and aerospace.
As part of his summer tour on the topic of #neueenergiethueringen, he visited medium-sized companies in Thuringia to get an impression of their path toward CO2 neutrality.
Unforgettable and exciting vacation days were experienced by three students at LCP, who mastered their joint challenge with the theme "Experience creativity with laser light" with flying colors.
Glass wafers are very sensitive to breakage and cracking. This makes processing them very demanding. UKP laser technology achieves the best and highest quality results here.
Successful laser fine machining of advanced ceramics, silicon and semiconductor substrates, and glass wafers is achievable through innovative UKP laser technology.
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