The technical article of LCP in the magazine “Mikroproduktion” examines taper-free ultra-short pulse laser drilling of hard, brittle materials, with a particular focus on thicker materials.
Contactless charging while traffic is moving - with precision components for the inductive charging infrastructure of tomorrow. Laser-machined, reliable, fit for the future.
Ceramic materials and precise laser technologies open up new horizons in microfluidics. Find out how ceramic microfluidic solutions can be implemented efficiently and sustainably in just a few production steps.
Climate technology is crucial for comfort, energy efficiency and the protection of electronic devices, as well as for people's health. Pressure sensors, whose circuit carriers are processed by laser and then finished into pressure sensors,…
Thanks to innovative ultrashort pulse laser technology, thin-film substrates can be structured with high precision and thus thin and narrow Hall probes can be produced for measuring the smallest air gaps in electric motors.
Climate change is omnipresent. Making a partial contribution is emission-free locomotion. This is exactly where LCP comes in with its knowledge in laser fine machining of the smallest components.
When cutting and removing silicon wafers maximum precision is required with the smallest contours on an extended surface. The classic mechanical method of wafer dicing reaches its limits here, as it cannot meet the requirements for fineness…
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