Latest news from the company

Climate technology is crucial for comfort, energy efficiency and the protection of electronic devices, as well as for people's health. Pressure sensors, whose circuit carriers are processed by laser and then finished into pressure sensors,…

Thanks to innovative ultrashort pulse laser technology, thin-film substrates can be structured with high precision and thus thin and narrow Hall probes can be produced for measuring the smallest air gaps in electric motors.

Climate change is omnipresent. Making a partial contribution is emission-free locomotion. This is exactly where LCP comes in with its knowledge in laser fine machining of the smallest components.

When cutting and removing silicon wafers maximum precision is required with the smallest contours on an extended surface. The classic mechanical method of wafer dicing reaches its limits here, as it cannot meet the requirements for fineness…

Using innovative laser technology and many years of know-how in laser application, the smallest packages and housings for gas sensors can be processed with high precision and in perfect quality.

Fast, extremely precise USP laser processing can be used to produce the smallest ferrite components and other materials for versatile use in power electronics.

Printed circuit boards (PCB) are found in all electronic devices - nothing works without them. In order to ensure long-term stable functionality, clean laser cutting technology is essential for their processing.

Electronic components are small and very sensitive. To ensure a long service life, they must be tightly sealed. The solution is laser fine welding with state-of-the-art laser technology.