Latest news from the company

Glass wafers are very sensitive to breakage and cracking. This makes processing them very demanding. UKP laser technology achieves the best and highest quality results here.

Successful laser fine machining of advanced ceramics, silicon and semiconductor substrates, and glass wafers is achievable through innovative UKP laser technology.

Under the motto "FULL LASER - Experience creativity with laser light" the Girls' Day starts with a full and interesting program at LCP Laser-Cut-Processing GmbH in Hermsdorf.

Converting ceramic powder into ceramic components by additive laser processing

We are exhibiting! Take the chance and visit us to learn everything about the latest topics and developments in the field of solder foils, leadframes, plug contacts, ceramic sensor carriers, printed circuit boards and much more!

We are there! Be there too and find out about the latest trends and innovations such as finest components for power electronics.

Visit us and learn all about the latest developments in electrical sheets, laser processing and packaging.

Girls experience state-of-the-art laser technology live!

A ZIM project by LCP Laser-Cut-Processing GmbH in cooperation with the Fraunhofer Institute for Ceramic Technologies and Systems IKTS.

Development of strategies for efficient data collection and evaluation within the framework of a process-accompanying PDA/MDA.