Donation to Hermsdorf elementary school - sports equipment

Commitment to sports and education of children

Once again, we took the opportunity to pass on some of our success to the region and are supporting an elementary school with a small donation.

Jena Laser Conference 2024

Jena Laser Conference 2024 - Meet us on site!

On November 6-7, the 14th Jena Laser Conference will once again open its doors to share the latest trends, challenges and development results in the laser industry. LCP will also be there.

IHK Prize “Company in responsibility”

We are proud of our award!

On September 12, 2024, we received a special honor at the first award ceremony of the East Thuringia Chamber of Industry and Commerce's award “Companies in responsibility”.

Thin film substrate structured with innovative UKP laser technology

High-precision laser structuring for the smallest air gap measurements

Thanks to innovative ultrashort pulse laser technology, thin-film substrates can be structured with high precision and thus thin and narrow Hall probes can be produced for measuring the smallest air gaps in electric motors.

LCP Open Day

Come in and be amazed - open day at LCP

Have you always wanted to take a look behind the scenes of laser fine machining? Now you have the opportunity. Immerse yourself in the world of #LASERPIONEERS.

Laser fine machining of pressure sensors for hydrogen vehicles: here water refueling station

Precise laser-processed pressure sensors for controlled safety in hydrogen vehicles

Climate change is omnipresent. Making a partial contribution is emission-free locomotion. This is exactly where LCP comes in with its knowledge in laser fine machining of the smallest components.

Funding project: Flexible laser fine processing of technical thin glass / to be seen: two hands with two puzzles, the logo of the EU and the logo of the Free State of Thuringia

Flexible laser fine processing of technical thin glass

Development of industrial processes for flexible processing of technical thin glass with the highest precision requirements.

Funding project: Water jet-guided laser processing of silicon carbide components / to be seen: four hands pulling on a rope, the logo of the EU and the logo of the Free State of Thuringia

Water jet-guided laser processing of silicon carbide components

As an innovative machining process, LCP is developing a so-called waterjet-guided laser process for machining hard-brittle materials, in particular technical ceramics.

Silicon wafers processed with innovative USP laser technology and cut into individual chips

Innovative ultrashort pulse laser technology revolutionizes the processing of silicon wafers

When cutting and removing silicon wafers maximum precision is required with the smallest contours on an extended surface. The classic mechanical method of wafer dicing reaches its limits here, as it cannot meet the requirements for fineness…

IHK student’s college

Your summer internship - experience the fascination of modern laser technology!

As part of the IHK School College, we offer pupils the opportunity to gain an insight into technical professions and discover the impressive world of laser processing.