As an innovative machining process, LCP is developing a so-called waterjet-guided laser process for machining hard-brittle materials, in particular technical ceramics.
When cutting and removing silicon wafers maximum precision is required with the smallest contours on an extended surface. The classic mechanical method of wafer dicing reaches its limits here, as it cannot meet the requirements for fineness…
As part of the IHK School College, we offer pupils the opportunity to gain an insight into technical professions and discover the impressive world of laser processing.
From June 11-13, we will be at the trade fair for power electronics, intelligent drive technology, renewable energy and energy management to present our outstanding solutions and services for power electronics.
From June 11-13, the leading trade fair for sensor, measuring and testing technology in Nuremberg will be presenting the latest trends and innovations in the industry. Immerse yourself in our world of laser-machined high-tech components for…
This year's Girls'Day will take place on April 25. LCP is once again taking part in Girls' Future Day and providing insights into the everyday working life of typical STEM professions. Girls will experience state-of-the-art laser…
You can meet us at Coil & Winding Expo in Augsburg from March 20-21. Our expertise in high-precision laser processing, such as laser cutting of electrical sheets, stacking and laser welding of stators and rotors, will also be on show.
Analysis of individual business processes, documentation in the form of an event-driven process chain and transfer of all results for the introduction of integrated planning software.
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