LCP Laser Cut Processing

Glass, silicon and ceramic substrates

Filigree precision components

Ceramic, glass and silicon wafers and substrates

Ceramics, glass, silicon - from these hard-brittle materials in the form of wafers or panels we manufacture filigree precision components such as customised useful substrates, moulded parts, spacers, housings and much more. In the context of microsystem and hybrid electronics, so-called thick-film or thin-film substrates serve as circuit carriers for electronic components such as resistors or integrated circuits (IC). Similar to plastic circuit boards made of FR3 or FR4 material, the substrate can be manufactured using multilayer technology or the individual conductor tracks can be printed in multiple layers. For wafers made of either mono- or polycrystalline silicon as blanks from the semiconductor or optics industry or panels made of high-performance ceramics and technical glasses, we offer not only laser processing but also mechanical dicing.

A selection of our ceramics

  • Aluminium oxide (Al2O3)

    Article Examples

    A476T
    AD96R
    Keral96
    Rubalit 708S
    Rubalit HP
    A493
    ADS998
    Keral99
    Keralpor99
    PlasmaPure
    Rubalit 710
    Saphir

    Material Properties

    • medium thermal conductivities (20 to 30 W/mK)
    • very good electrical insulation (1 x 1014 to 1 x 1015 Ωcm).
    • flexural strength (800 MPa), high compressive strength (2 to 4 GPa)
    • resistant to thermal shock
    • chemically resistant
    • bioinert and compatible with foodstuffs
    • max. application temp. between 1000 to 1500 °C (without mechanical load).
    • surface as-fired: Ra 0.2-0.8 μm suitable for thick-film coating (DS)
    • surface as-fired: Ra < 0.1 μm suitable for thin films (DF)
    • available as dense and porous material

    Manufacturer Selection

    • CeramTec
    • CoorsTek
    • Kerafol
    • Kyocera
    • Maruwa

    Dimensions (Selection)

    Dimensions: 115 x 115/ 165 x 115/ 190 x 138 mm
    Thickness: 0.12 - 3.0 mm (+/- 10%)
    Deflection from thickness 0.5 mm 0.2 - 0.3% of the longest side

    Downloads

    • pdf
      Design Guideline Ceramics
      2 MB
  • Aluminium nitride (AlN)

    Article Examples

    AlUNIT
    AlN 170
    AlN 180
    AlN 200
    AlN 230

    Material Properties

    • very high thermal conductivity (170 - 230 W/mK)
    • good electrical insulation (1 x 105 to 1 x 109 Ωcm).
    • flexural strength (300 to 400 MPa), compressive strength > 2 GPa
    • very good thermal shock resistance
    • chem. resistance: not resistant to caustic soda; inert to melting of III-V compounds; less suitable for applications at temperatures above 1,000°C in water- or oxygen-containing
    • oxygen environment or under mechanical stress with simultaneous wetting by water.
    • manufacturing process: hot-pressed, dry-pressed, film-cast

    Manufacturer Selection

    • CeramTec
    • CoorsTek
    • QSIL
    • Maruwa

    Dimensions (Selection)

    Dimensions: 114 x 114 / 150 x 140 / 138 x 190 mm
    Thickness: 0.25 - 5.0 mm 

    Downloads

    • pdf
      Design Guideline Ceramics
      2 MB
  • Zirkonoxid (ZrO2)

    Article Expamples

    3YSZ
    Dura-Z
    Keralpor99 Z
    Keraprotec
    PSZ
    Rubalit HSS
    YTZP
    ZTA

    Material Properties

    • low thermal conductivity (1.5 to 3 W/mK)
    • good electrical insulation, oxygen ion conductive
    • high flexural strength (> 1 GPa) and fracture resistance
    • very high compressive strength (> 4.7 GPa)
    • very good tribological properties
    • chemically resistant
    • fatigue resistant due to phase transformation hardening
    • bioinert and compatible with foodstuffs
    • max. operating temperature between 600 and 1100 °C
    • also available as porous sintered base with good flatness and purity

    Manufacturer Selection

    • CeramTec
    • CoorsTek
    • Kerafol, Maruwa

    Dimensions (Selection)

    Dimensions: 50 x 50 / 100 x 100 / 150 x 150 mm
    Thickness: 0.15 - 0.5 mm (+/- 10%)

    Downloads

    • pdf
      Design Guideline Ceramics
      2 MB
  • Siliciumcarbid (SiC)

    Article Examples

    SiC
    RSiC
    SiSiC
    Ultra-SiC
    UltraClean
    Pure-SiC

    Material Properties

    • very high thermal conductivity (120 - 200 W/mK)
    • very high hardness
    • corrosion and wear resistant
    • good tribological properties
    • resistant to thermal shock
    • max. operating temperature between 1350 and 1600 °C
    • Manufacturing process: directly sintered, recrystallised, CVD ( high purity)

    Manufacturer Selection

    • CoorsTek
    • QSIL
    • Kyocera Fineceramics
    • SiCeram
    • CeramTec
    • Fraunhofer IKTS

    Dimensions (Selection)

    Dimensions: 150 x 150 / 115 x 115 mm
    Thickness: 2.0 - 6.0 mm

    Downloads

    • pdf
      Design Guideline Ceramics
      2 MB
  • Siliciumnitrid (Si3N4)

    Article Examples

    Si3N4

    Material Properties

    • medium thermal conductivity
    • high compressive strength (3 GPa)
    • good fracture and crack toughness (7 MPa√m)
    • good tribological properties
    • resistant to thermal changes, thermal shock and high temperatures
    • chemically resistant

    Manufacturer Selection

    • CeramTec
    • Kyocera Fineceramics
    • Kyocera
    • SiCeram
    • QSIL
    • CoorsTek
    • Fraunhofer IKTS

    Dimensions (Selection)

    Dimensions: Ø 650 mm bis 700 x 450 mm
    Thickness: 1.0 - 5.0 mm

    Downloads

    • pdf
      Design Guideline Ceramics
      2 MB
  • Glass ceramic / Glass

    Article Examples

    LTCC
    Borofloatglas
    Quarzglas
    Glaslotfolien
    D263Teco®
    AF32eco®
    Borosilikatglas
    Perlucor®

    Material Properties

    LTCC (Low-Temperature-Cofired-Ceramic):

    • unsintered (mixture of glass, ceramic and organic solvent), flexible
    • sintering already at 900 °C, good for co-firing with metallic components
    • suitable for HF-application
    • Thermal conductivity (typ. 2 to 3 W/mK)
    • max. application temperature only a few 100 °C

    Glass:

    • thermal conductivity (0.6 - 1.4 W/mK)
    • electr. insulation (1010 to 1014 Ωm)
    • max. operating temp. depends on glass system (100 °C to over 1000 °C)
    • thermal shock resistance depends on glass system
    • provided with filter/protective layers on one/ both sides

    Manufacturer Selection

    • AGC Asahi Glass
    • CeramTec
    • Corning
    • DuPont
    • Kerafol
    • Plan Optik
    • Saint Gobain
    • Schott AG

    Dimensions (Selection)

    Dimensions LTCC: up to 152.4 x 152 mm
    Thickness LTCC: 127 - 254 µm (unsintered)

    Dimensions Glass: Ø 50.8 / 100 mm to 1150 x 850 mm
    Thickness Glass: 250 / 430 / 550 / 650 µm

    Downloads

    • pdf
      Design Guideline Ceramics
      2 MB
  • Silizium (Si)

    Article Examples

    monokristallines Si
    polykristallines Si
    Si-Wafer monokr.

    Material Properties

    • thermal conductivity 150 W/mK
    • electr. insulation (1 x 10 - 6 to 50 Ωm)
    • typ. operating temp. between -40 and 90 °C
    • can be provided with filter/protective layers on one or both sides
    • chem. resistance: little reactive, at very high temperatures influence of various gases transformations possible

    Manufacturer Selection

    • Hemlock Semiconductor Group
    • Wacker Chemie AG
    • Siltronic AG
    • PV Crystalox Solar Silicon GmbH

    Dimensions (Selection)

    Dimensions: Ø 50.8 / 76.2 / 100 / 150 / 200 / 300 mm
    Thickness: 0.12 - 3.0 mm

    Downloads

    • pdf
      Design Guideline Ceramics
      2 MB

The properties of glass, silicon and ceramics:

  • thermally conductive
  • electrically insulating
  • resistant to temperature changes
  • resistant to bending and pressure (depending on material)
  • wear-resistant

Application Examples

  • network substrates and printed circuit boards
  • ceramic components such as spacers, moulded parts and housings
  • sensor bases
  • masks and stencils

Thermal management in PCBs

Conductive tracks are electrically conductive connections of electronic components on printed circuit boards and integrated circuits. To prevent short circuits or high leakage currents from occurring during current and voltage supply and signal transmission, the conductor paths must be electrically well insulated from each other.

Printed circuit boards or circuit carriers made of glass, ceramics, silicon are ideally suited as heat sinks, as they have an electrically insulating and thermally conductive effect at the same time. Low Temperature Cofired Ceramics, also known as LTCC ceramics, is a technology for manufacturing multilayer circuits based on sintered ceramic carriers in electronics.

Ceramic substrates and more: specialised in special materials

Our special expertise is in the procurement and processing of special materials: from aluminium oxide and zirconium oxide to LTCC and glass foils, aluminium nitride, silicon nitride, silicon carbide and mono- or polycrystalline silicon. The following technologies can be used here:

More info about our materials

The specific data sheets of the individual materials are available on request. The material listing is only a current selection without any claim to completeness. Do you have special requirements? We will be happy to advise you personally on your questions regarding our available materials and services.

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