Successful laser fine machining of advanced ceramics, silicon and semiconductor substrates, and glass wafers is achievable through innovative UKP laser technology.
Under the motto "FULL LASER - Experience creativity with laser light" the Girls' Day starts with a full and interesting program at LCP Laser-Cut-Processing GmbH in Hermsdorf.
We are exhibiting! Take the chance and visit us to learn everything about the latest topics and developments in the field of solder foils, leadframes, plug contacts, ceramic sensor carriers, printed circuit boards and much more!
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![[Translate to English:] Silizium Wafer](/fileadmin/_processed_/4/5/csm_silizium_wafer_842_022e209b94.jpg)
