Nowadays, electronic components are used in a wide variety of applications, such as in industry for automated processes, in medical technology for analysis equipment and surgical tools, in aerospace as positioning systems and drive technology, and in the automotive sector.
To ensure a long service life for these sensitive components, they must be sealed hermetically or helium-tight. It is important to ensure that the ultra-thin membranes or housings already fitted with electronics are welded without distortion and, above all, are mechanically stable. Also, with regard to the minimum size of the components as well as their complex geometries, the processing of these requires a highly precise, flexible and reliable joining process. Special challenges exist for sensors that must be "packaged" in an enclosure to protect themselves due to their harsh environmental conditions as pressure or flow sensors, in batteries, as strain gauges or position sensors. Here, a minimum spot diameter is required for laser welding in order to achieve the smallest possible heat-affected zone and thus hardly any distortion as well as hardly any influence on the surrounding electronics.
Here, LCP Laser-Cut-Processing GmbH uses laser fine welding by means of innovative fiber laser technology. It describes a special process for joining metallic components of electronics and sensors and is characterized by a high welding speed, precise and narrow weld seams as well as low thermal distortion due to minimal heat input. Thanks to its high energy concentration, the laser beam joins components with pinpoint accuracyand up to eight times faster than conventional welding processes. In addition, laser welding is a non-contact process without tool wear. At LCP, the ambient atmosphere, such as nitrogen or argon, and the welding regime, whether pulsed or cw, can be flexibly selected during fine welding. In addition, the company can implement various seam shapes such as lap weld, butt weld, fillet weld, patting including wobble function according to customer requirements and demands with relatively large working distance. In order to be able to carry out the necessary verifications for the weld seam quality, a microsection laboratory as well as crowning chambers and helium leak testers are available in house.
Many years of experience in the application of special materials make LCP Laser-Cut-Processing GmbH the application center and supplier for high-end micro material processing of sensitive electronics. The company uses the latest generation of innovative fiber laser technology for capping, enclosing, joining and connecting electronic components, which is significantly more flexible than electron beam or ultrasonic friction welding, for example. Outsource your micro material processing challenges to the specialist. In this way, you remain flexible, can focus on your core competencies and save on your own costly and maintenance-intensive plant technology, tied-up personnel resources and many years of building up in-depth know-how. Your advantage with LCP: You receive a fast, reliable special service adapted to your individual needs, on which you can rely - from consulting and prototype production to possible series production along the entire process chain!
Please feel free to contact us!
![[Translate to English:] Silizium Wafer](/fileadmin/_processed_/4/5/csm_silizium_wafer_842_022e209b94.jpg)
